In September, I announced the return of the Windows Hardware Engineering Community (WinHEC) Summit in Shenzhen, March 18th and 19th. I am happy to announce today that registration for WinHEC has now started. If you are interested in attending, please request an invitation here.
The WinHEC Summit represents an important milestone for Microsoft as we continue to engage and partner throughout our Windows ecosystem. The last WinHEC occurred in 2008 and we’re honored that we’re able to start the series off again in Shenzhen. Microsoft looks forward to connecting with and learning from various OEMs, ODMs and other partners in Taiwan, Shenzhen, and the greater China community as we all work together to make Windows devices great.
Terry Myerson, Executive Vice President of the Operating Systems Group, is slated to keynote on the 18th. WinHEC Shenzhen is designed for executives, engineering managers, engineers and technical product managers at OEMs, ODMs, IHVs and IDHs who work with, or want to work with, Windows technologies. The agenda will consist of deep technical training sessions and hands-on labs across the spectrum of Windows based hardware, ranging from 2-1 PCs to Smartphones and IoT devices, as well as enabling hardware components and peripheral devices. In addition to the technical training tracks, there will also be opportunities to have two-way discussions with Microsoft executives and engineering experts. Specific details on the summit agenda will be disclosed closer to the event. To learn more, please visit http://www.winhec.com/, or to request an invitation, click here.
More to come!